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COMPANY PROFILE-CAPABILITY
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Description
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Capabilities
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|
| Layer Count: | Double Side up to10 Layers | |
| Material: | - Type | FR-4, CEM-3 |
| - Tg | 130oC, 140oC, 170oC | |
| Min. Finishing THK. | - Double Side | 0.3 mm (12 mil) |
| - 4 - Layers | 0.6 mm (24 mil) | |
| - 6 - Layers | 0.8 mm (32 mil) | |
| Board Finishing: | 1). Fully Flash Gold Plating (0.025-0.05 Micron) | |
| 2). Fully Thick Gold Plating (0.05-0.5 Micron) | ||
| 3). Hot Air Solder Leveling | ||
| 4). Entek Coating (CU-106A) | ||
| 5). Immersion Gold Plating (0.025-0.075 Micron) | ||
| Min Hole Size (Finishing): | 0.30 mm (12 mil) | |
| Min Line Width / Spacing: | 0.10 mm / 0.10 mm (4 mil) | |
| Base Copper Thickness: | 1/2 oz - 3 oz (18-105 Micron) | |
| Line Width Spacing Tolerance: | 0.04 mm (1.5 mil) | |
| Min Solder Mask Clearance: | 0.10 mm (4 mil) | |
| Hole to Hole Min. Distance: | 0.25 mm (10 mil) | |
| Min. Circuit to Board Edge Spacing: | Blanking = 0.30 mm (12 mil) | |
| Routing = 0.25 mm (10 mil) | ||
| Min. Annular Ring Size: | 0.15 mm (6 mil) | |
| Layer Registration: | 0.08 mm (3 mil) | |
| Special Requirement: | Blind / Buried Via Hole | |
| Open / Short Testing: | 200% Coverage (2 times) | |
